Reflow Soldering¶
Use of "No Clean" soldering paste is recommended as it does not require cleaning after the soldering process. The following examples of paste meet these criteria.
| Solder | Details |
|---|---|
| Soldering Paste | OM338 SAC405 / Nr.143714 (Cookson Electronics) |
| Allow Specification | Sn 95.5/ Ag 4/ Cu 0.5 (95.5% Tin/ 4% Silver/ 0.5% Copper) |
| Melting temperatures | 217 °C |
The following reflow profile is recommended for soldering:¶
| Phase | Name | Recommended | Details |
|---|---|---|---|
| Preheat | |||
| dT/dt | 3°C/sec | Preheat Temperature Rise Rate | |
| TsMIN | 150°C | Preheat Minimum Temperature | |
| TsMAX | 200°C | Preheat Maximum Temperature | |
| tsPreheat | 60 - 120 sec | Time Spent Between Preheat MIN and Max temperatures | |
| Reflow | |||
| TL | 217°C | Reflow Liquidus temperatures | |
| TP | 245°C | Reflow Peak temperatures | |
| tL | 40-60 sec | Time Spent above Reflow Liquidus temperatures | |
| Cooling | |||
| dT/dt | 4°C/sec | Maximum Cooling Temperature Fall Rate |
Note:¶
- A convection soldering oven is highly recommended over an infrared type radiation oven as it allows precision control of the temperature and all parts will be heated evenly.
- To avoid falling off, the IMX should be placed on the topside of a PCB during soldering.
- The part must not be soldered with a damp heat process.