Reflow Soldering
Use of "No Clean" soldering paste is recommended as it does not require cleaning after the soldering process. The following examples of paste meet these criteria.
Solder |
Details |
Soldering Paste |
OM338 SAC405 / Nr.143714 (Cookson Electronics) |
Allow Specification |
Sn 95.5/ Ag 4/ Cu 0.5 (95.5% Tin/ 4% Silver/ 0.5% Copper) |
Melting temperatures |
217 °C |
The following reflow profile is recommended for soldering:

Phase |
Name |
Recommended |
Details |
Preheat |
|
|
|
|
dT/dt |
3°C/sec |
Preheat Temperature Rise Rate |
|
TsMIN |
150°C |
Preheat Minimum Temperature |
|
TsMAX |
200°C |
Preheat Maximum Temperature |
|
tsPreheat |
60 - 120 sec |
Time Spent Between Preheat MIN and Max temperatures |
Reflow |
|
|
|
|
TL |
217°C |
Reflow Liquidus temperatures |
|
TP |
245°C |
Reflow Peak temperatures |
|
tL |
40-60 sec |
Time Spent above Reflow Liquidus temperatures |
Cooling |
|
|
|
|
dT/dt |
4°C/sec |
Maximum Cooling Temperature Fall Rate |
Note:
- A convection soldering oven is highly recommended over an infrared type radiation oven as it allows precision control of the temperature and all parts will be heated evenly.
- To avoid falling off, the IMX should be placed on the topside of a PCB during soldering.
- The part must not be soldered with a damp heat process.