Use of "No Clean" soldering paste is recommended as it does not require cleaning after the soldering process. The following examples of paste meet these criteria.
|Soldering Paste||OM338 SAC405 / Nr.143714 (Cookson Electronics)|
|Allow Specification||Sn 95.5/ Ag 4/ Cu 0.5 (95.5% Tin/ 4% Silver/ 0.5% Copper)|
|Melting temperatures||217 °C|
The following reflow profile is recommended for soldering:¶
|dT/dt||3°C/sec||Preheat Temperature Rise Rate|
|TsMIN||150°C||Preheat Minimum Temperature|
|TsMAX||200°C||Preheat Maximum Temperature|
|tsPreheat||60 - 120 sec||Time Spent Between Preheat MIN and Max temperatures|
|TL||217°C||Reflow Liquidus temperatures|
|TP||245°C||Reflow Peak temperatures|
|tL||40-60 sec||Time Spent above Reflow Liquidus temperatures|
|dT/dt||4°C/sec||Maximum Cooling Temperature Fall Rate|
- A convection soldering oven is highly recommended over an infrared type radiation oven as it allows precision control of the temperature and all parts will be heated evenly.
- To avoid falling off, the IMX should be placed on the topside of a PCB during soldering.
- The part must not be soldered with a damp heat process.